Name:Fengbin Tu

Bio:

Fengbin Tu is an Assistant Professor of ECE Department, Associate Director of Institute of Integrated Circuits and Systems, and Associate Director of HKUST and Intel Joint Laboratory at The Hong Kong University of Science and Technology. He is the recipient of NSFC Excellent Young Scientists Fund. He received the Ph.D. degree from Institute of Microelectronics, Tsinghua University, in 2019, with the Tsinghua Excellent Dissertation Award. He was a Postdoctoral Scholar at University of California, Santa Barbara, from 2019 to 2022, and a Postdoctoral Fellow at the AI Chip Center for Emerging Smart Systems (ACCESS) under InnoHK, from 2022 to 2023. His research interests include AI chip and computing-in-memory. He has published 2 books and over 70 papers, including top conferences and journals on integrated circuits and computer architecture (ISSCC, JSSC, DAC, ISCA, MICRO, et al.). His AI chips Thinker and ReDCIM have been recognized by the ISLPED Design Contest Award (2017) and Top-10 Research Advances in China Semiconductors (2023). He has received the MIT Technology Review “Innovators Under 35” (TR35) Asia-Pacific (2025), Gold Medal with Jury Congratulations at the Inventions Geneva (2025), and WAIC Yunfan Award-“Bright Stars” (2024). He has served as the Design Contest Chair of ASP-DAC 2026 and TPC member of ISCA, A-SSCC, DAC, and ASP-DAC.

Country:China

Affiliation:The Hong Kong University of Science and Technology

Research interests:AI Chip, Computing-in-Memory, Computer Architecture, Reconfigurable Computing